Glass with copper paste PCB
Features:
▪ Layer count —— Single side
▪ Material —— Glass
▪ Board thickness —— 1.0 +/-0.005mm
▪ Line width/Line spacing —— 4/4mil
▪ Application —— Lighting
▪ High dielectric strength —— ≥15KV/mm
▪ Low CTE —— 9.9ppm/K
▪ Low permittivity
Alumina（96%Al2O3）
Ceramic PCB
Features:
▪ Layer count —— Single side
▪ Material —— Alumina
▪ Board thickness —— 1.0 +/-0.005mm
▪ Line width/Line spacing —— 4/4mil
▪ Application —— Automotive、Lighting
▪ High stability、Low permittivity
▪ High thermal conductance —— ≥24W/M·K
▪ High dielectric strength —— ≥15KV/mm
▪ Low CTE —— 6.7~7.8ppm/K
IC Substrate
▪ Layer count——6L
▪ Material——DS7409-HGB
▪ Board thickness——0.5mm
▪ Copper Thickness——H/H oz
▪ Min. LW/LS——0.05/0.04mm
▪ Min. Drill Size ——0.07mm
▪ Surface Finish——ENEPIG
Optical module products
▪ Layer count——10L
▪ Product model——400Gbps QSFP-DD
▪ Material——M6（R-5775）
▪ Finished Thickness——1.0±0.075mm（Gold Finger）
▪ Plug shape tolerance——±0.05mm
▪ Hole filling depression——＜15μm
▪ Surface Finish——ENEPIG+Hard gold
▪ Thermal management——Buried copper block
Special PCB For MinLED
▪ Layer count —— 8L
▪ HDI(2+N+2)
▪ Micro vias —— L1-L2, L2-L3, L6-L7, L7-L8
▪ Buried holes ——L2-L7
▪ Pad to Pad spacing —— 2.8mil
▪ Pad size ——3.0x3.0mil
▪ Surface Finishing — ENEPIG
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