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Phased Array Radar: On the Eve of Mass Application

Phased Array Radar: On the Eve of Mass Application

2024.04.20

The phased array system generally accounts for nearly 50% of the total cost of the radar system, and the T/R module accounts for about 45% of the phased array system cost, with the RF chip having the largest share.

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In-Depth Analysis of CPE: Exploring FWA Technology in the 5G Era

In-Depth Analysis of CPE: Exploring FWA Technology in the 5G Era

2024.04.02

FWA (Fixed Wireless Access) is a technology that combines fixed-line and wireless communication, specifically designed to offer broadband access services to users.

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As chip packaging advances, the IC carrier board leads the way

As chip packaging advances, the IC carrier board leads the way

2024.01.08

DIP dual in-line package, component package, PGA pin grid, BGA ball grid array (PBGA substrate, CBGA substrate, FCBGA substrate, TBGA substrate, CDPBGA substrate), CSP package (traditional lead frame form, rigid interposer type, soft interposer type, wafer size package), MCM package, etc.

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Why Mini LED is the next generation display technology?

Why Mini LED is the next generation display technology?

2023.12.20

Take the LED screen with P0.9 for example.Generally, the PCB of COB-P0.9 is 8 layers and 3 levels.Because the lamp bead itself has been integrated with circuits, the IMD-M09T only requires 8 pins for 4 pixels, which increases the PCB wiring space of the screen factory by 50%. Customers using the IMD-M09T typically only require 6 layers of 2-stage PCBs, which is more than 20% cheaper.SMD also requires an 8-layer 3-stage PCB board, but the accuracy requirements are not as high as COB.

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Principle of Planar Transformers and PCB Design Guidelines

Principle of Planar Transformers and PCB Design Guidelines

2023.12.20

When designing a multilayer PCB for a planar transformer, it is recommended to use a symmetrical stacking design to avoid deformation during PCB processing and assembly. The thickness of the dielectric layers needs to meet the insulation requirements for the primary and secondary windings, and the dielectric thickness of the entire stack should be uniform.

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Deeply teardown 4D millimeter-wave radar, from design to PCB solution

Deeply teardown 4D millimeter-wave radar, from design to PCB solution

2023.12.20

whether it is traditional millimeter-wave radar or 4D millimeter-wave radar, the mainstream solution will have two high-frequency layers in the PCB laminate, using PTFE as the material. The PCB board for 4D millimeter-wave radar has also been upgraded from the primary PTFE material (such as RO4850/RO4350) to a higher-grade high-frequency PTFE material (such as RO3003/RO3006).

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