Tg, which stands for Glass transition temperature, is an abbreviation where "T" represents temperature and "g" is subscript, representing "Glass."
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The performance indicators for FR-4 substrates include the glass transition temperature (Tg), the thermal decomposition temperature (Td), the dissipation factor (Df), the dielectric constant (Dk), the comparative tracking index (CTI), the thermal expansion coefficient (CTE), the water absorption rate, and the material's adhesion characteristics.
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Before the PCB design starts, the Layout engineers will determine the number of layers of the PCB according to the size of the board, the scale of the circuit, and the requirements of electromagnetic compatibility (EMC). Then they will determine the component layout, and finally confirm the division of signal layers, power layers, and ground layers.
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Considering that the backplane needs to withstand high-frequency, high-capacity high-speed signal transmission, the backplane PCB design needs to consider electrical performance, mechanical performance, reliability, heat dissipation performance, and other aspects. During manufacturing, high-performance materials and high-precision processing techniques are required to ensure that the backplane PCB meets performance requirements and works stably.
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What is PCB surface finish process?Where there is …
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Under the current trend of high-speed and high-frequency, the more mainstream PCB materials include polytetrafluoroethylene resin (PTFE), epoxy resin (EP), bismaleimide triazine resin (BT), thermosetting cyanate ester resin (CE), thermosetting polyphenylene ether resin (PPE) and polyimide resin (PI), which lead to more than 130 types of copper clad laminates. Their common characteristics are that the dielectric constant and dielectric loss factor are very low or low.
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