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Sunshine is committed to technology development

Our CTO David Aldape has over 30 years of industry experience,and leads a dedicated team of R&D engineers.

Development projects for 2016-2017:

Increase Plating Aspect Ratio to 30:1 or higher

Backplane capability;large format and very thick boards

Reduce controlled impedance to lerance of ±5% or less

Introduction of advanced plating and photo lithography methods

Advanced tooling systems for improving L2L registration

Continual addition of new materials for HDI, High Speed/Low Loss,thinnerstructures and sub‐assemblies applications (for example: ZETA®,I‐Tera®,I‐Speed®,Tachyon G100®, Megtron 7, and EMC 828&888K)

Deep Microvias (L1‐L3, Aspect Ratio 1:1 or greater)

Thermal Management Solutions: Metal Core, Conductive Paste (Ormet and Tatsuta)

Embedded Component PCBs.

2017-2021 R&D Planned Expenditure 

Subsidiaries:SGC Germany  |  Sunshine PCB GmbH   |  SGC USA
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