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Sunshine is committed to technology development

Our CTO David Aldape has over 30 years of industry experience,and leads a dedicated team of R&D engineers.

Development projects for 2016-2017:

Increase Plating Aspect Ratio to 30:1 or higher

Backplane capability;large format and very thick boards

Reduce controlled impedance to lerance of ±5% or less

Introduction of advanced plating and photo lithography methods

Advanced tooling systems for improving L2L registration

Continual addition of new materials for HDI, High Speed/Low Loss,thinnerstructures and sub‐assemblies applications (for example: ZETA®,I‐Tera®,I‐Speed®,Tachyon G100®, Megtron 7, and EMC 828&888K)

Deep Microvias (L1‐L3, Aspect Ratio 1:1 or greater)

Thermal Management Solutions: Metal Core, Conductive Paste (Ormet and Tatsuta)

Embedded Component PCBs.

Technology Roadmap
inch [mm]Standard
2018
Advanced
2018
Emerging
2018-2019
Future
2020
Key AttributesLayer CountUp to 16L18L to 28L30L to 36L40+L
Min/Max Thickness012” [.30]/.125" [3.2].008" [.20]/.200" [5.08].006” [.15]/.250" [6.35]TBD/≥.300" [7.62]
Largest Panel18x24[457x610]24x30 [610 x 762]24x42 [610 x 1067]undetermined
 
Minimum Line and Space (Copper Wts*)Inners.004" [.10] 1.003" [.076] H.002" [.05] 5um<.002" [.05] Qoz
Outers.004" [.10] T.003" [.076] Q.002" [.05] 5um<.002" [.05] Qoz
Tolerance±.0005" [.013]±.0003" [.008]±.00025" [.006]±.0002" [.005]
 
Drilled Vias SizeDrill Size.008" [.20].006" [.15].006" [.15].006" [.15]
Pad Diameter+.008" [.20]+.008" [.20]+.006" [.15].006" [.15]
Aspect Ratio10:120:125:130:01:00
Base copper weights: 1=1oz H=1/2 OZ, T=3/8 OZ, Q=1/4 OZ
Via StructuresMicrovias1+N+12+N+23+N+3ELIC
Buried SubsYesYesYesYes
Stacked MicroviaStacked on SubYesYesYes
 
MicroviasMin Via Size.004" [.10].004" [.01].003" [.76].002" [.05]
Pad Diameter+.008" [.20]+.006" [.15]+.004" [.10]+.003" [.076]
Aspect Ratio0.8:11:11:11:1
 
Conductive & Non-Conductive Via FillMin Hole Size.008" [.20].008" [.20].006" [.15]<.006" [.15]
Aspect Ratio12:118:126:130:1
 
SoldermaskRegistration±.002" [.05]±.0015" [.038]±.001" [.025]Tangency
Min Opening.004" [.10].003" [.076].002" [.05]SMDP
Dam Min Width.003" [.08].002" [.05].0015" [.038]Eng Eval
Surface FinishesENIG, OSPENEPIGThick Gold Multiple Finishesundetermined
Im Sn, Im AgWire Bondable Gold
LF HASLMultiple Finishes
Hard Gold Body
Material OptionsRogers 3000/4000Ultra Low Loss Dk/DfBuried Wire
Buried Components
Halogen Free FR4 EMC 828, EMC 888KI-Tera® I-Speed® EMC 891KTachyon 100G® MetroWave
Buried CapacitancePolyimid, Megtron 6NMegtron 7N, EMC 890K
408 HR Nelco-13sHybrid PCBsThermal Management PCBs
Subsidiaries:SGC Germany  |  Sunshine PCB GmbH   |  SGC USA
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