· 26-Layer 7 Steps HDI with ENIG + Gold Finger High Speed Digital
· EMC EM-890K
· 7 Steps 0.1mm Micro-via + Buried Via +Through hole design
· 28-Group impedance with tolerance ±10%
· Decapping, Stepped gold fingers
· 20-Layer ENIG and Back-drill High Speed Digital
· Panasonic R-5785(GN)
· 10 Different back drill depth
· Aspect ratio of 19:1
· 12-Layer 5 Steps ELIC HDI with ENEPIG
· Very Low loss, Low DK materials
· 76/50um Bonding pad
· Impedance tolerance ±8%
· 24-Layer Immersion Tin with Backdrill High Speed Digital
· S7439C
· 3 Different back-drill depth
· 16-Layer 6oz Heavy Copper and Thick Board Thickness
· TUC TU-865
· 8.4mm ultra-thick board
· Depth controlled drilling
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