Preferred Materials
FR4 Standard TgShengyi, ITEQ, KB, Nanya

FR4 Mid Tg (Lead Free


Shengyi S1000, ITEQ IT158

FR4 High Tg

(Lead Free Compatible)

Shengyi S1000‐2, S1170
Isola 370HR
Panasonic R1755V

High Performance

Low Loss FR4

EMC EM828, EM888(S), EM888(K)
Isola FR408, FR408HR
Isola I‐Speed, I‐Tera MT
Nelco N4000‐13EP, EPSI
Panasonic R5775 Megtron 6
RF MaterialsRogers RO4350, RO3010
Taconic RF‐30, RF‐35, TLC, TLX, TLY
Taconic 601, 602, 603, 605
Halogen Free
EMC EM285, EM370(D)
Panasonic R1566
Aluminum Backed PCBShengyi SAR20, Yugu YGA
Additional Materials
 Rigid Polyimide:  Shengyi SH260, Ventec VT901
 BT Epoxy:  Nelco and Mitsubishi
 High CTI FR4:  Shengyi S1600
 Flexible Circuit Materials:  Dupont, Panasonic, Taiflex, Shengyi 
Surface Finishes
Electroless Nickel Immersion Gold (ENIG)
Hot Air Solder Level (HASL, Lead and Lead‐free)
OSP, Immersion Tin,Immersion Silver, ENEPIG
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold
Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM
PCB TechnologiesStandardAdvanced
Rigid‐Flex & Flexible CircuitsYY
Buried and Blind ViasYY
Sequential LaminationYY
Impedance Control ± 10%± 5%
Hybrids & Mixed Dielectrics YY
Aluminum PCB's YY
Non‐Conductive Via Fill (VIP) YY
Conductive Via Fill YY
Cavity Boards YY
Controlled Depth Drill and RoutYY
Edge Plating YY
Buried CapacitanceYY
Etch BackYY
In‐board BevelingYY
2‐D Bar Code PrintingYY
Standard FeaturesStandardAdvanced
Maximum Layer Count4050
Maximum Panel Size 720x621mm [21x24"]621x1219mm [24x42"]

Outer Layer Trace/Spacing

(1/3oz starting foil + platig)





Inner Layer Trace/Spacing

 (Hoz inner layer cu)   

Maximum PCB Thickness3.2mm [0.125"]6.5mm [0.256"]
Minimum PCB Thickness.20mm [0.008"].10mm [0.004"]
Minimum Mechancial Drill Size.20mm [0.008"].10mm [0.004"]
Minimum Laser Drill Size.10mm [0.004"].05mm [0.002"]
Maximum PCB Aspect Ratio25:140:1
Maximum Copper Weight5 oz [178µm]6 oz [214µm]
Minimum Copper Weight1/3 oz [12µm]1/4 oz [9µm]
Minimum Core Thickness50µm [0.002"]38µm [0.0015"]
Minimum Dielectric Thickness64µm [0.0025"]38µm [0.0015"]
Minimum Pad Size Over Drill 0.46mm [0.018"]0.4mm [0.016"]
Solder Mask Registration± 50µm [0.002"]± 38µm [0.0015"]
Minimum Solder Mask Dam76µm [0.003"]64µm [0.0025"]
Copper Feature to Edge, V‐cut (30°)0.40mm [0.016"]0.36mm [0.014"]
Copper Feature to PCB Edge, Routed0.25mm [0.010"]0.20mm [0.008"]

Tolerance on Overall 


± 100µm [0.004"]±50µm [0.002"]
HDI Features StandardAdvanced
Minimum Microvia Hole Size 100µm [0.004"]50µm [0.002"]
Capture Pad Size0.25mm [0.010"]0.20mm [0.008"]
Glass Reinforced DielectricsYY
Maximum Aspect Ratio0.7:11:1
Stacked MicroviasYY
Copper Filled MicroviasYY
Buried Filled ViasYY
Maximum No. of Buildup Layers3+N+35+N+5
Advanced Processes
Direct Imaging for Innerlayers, Outerlayers, and Soldermask
Direct Plating for High Layer Count and Microvias Products
Reverse Pulse Plating
Solid Copper Plated PTH Vias
XACT Tooling System for Improved Layer‐to‐Layer Registration
Spray Coating for Soldermask
Inkjet Printing for Legend
In‐Line AOI for Outerlayers and AOI for Final Inspection
ORMET® Copper Paste for Any‐layer Connections
ZETA® Material for HDI and Low‐Loss Applications
Quality System and Certifications

IPC Specs: IPC‐A‐600, IPC‐6012, IPC‐6013, IPC‐6016 (Class II and 

Class III)

Quality System Certifications:  ISO 9001:2008, TS16949:2009, ISO13485:


Environmental Certifications: ISO14001:2004, ISO/TS14067:2013
UL Certification:  File number E229342
Subsidiaries:SGC Germany  |  Sunshine PCB GmbH   |  SGC USA
©Sunshine Global Circuits Co., Ltd.2018 All rights reserved. 粤ICP备05084072号   Design