· 42-Layer Large-size ENIG High Speed Digital
· TUC TU-933+
· 1041*621 Large size
· Aspect ratio 18.5
· Multiple back-drill
· 6.510mm Board thickness with tolerance ±6%
· 20-Layer ENIG Back-drill and Buried Via High Speed Digital
· PPE+FR4
· Panasonic R-5785(GE)+S1000-2M
· 8 Different back drill depth
· High layer count
· 10-Layer RF Microwave with Blind Via ENIG and Hybrid Design
· FR4+Hydrocarbon
· S1000-2M+Rogers RO4360G2
· Edge plating
· 20-Layer ENIG Back-drill and Buried Via High Speed Digital
· PPE+FR4
· Panasonic R-5785(GE)+S1000-2M
· 8 Different back drill depth
· High layer count
· 22-Layer 1 step HDI ENIG Heavy Copper
· TUC TU-865
· Copper-filled vias
· Outer-layer laser-drilled micro-via
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