| AI Data Center High Speed High Density | ||
| Features | Standard | Advanced |
| Max. Layer Count | 42 | 62 |
| Max Board Thickness | 6mm | 8mm |
| Outer Layer Line Width/Spacing | 3.5/3.5mil | 3.0/3.5mil |
| Inner Layer Line Width/Spacing | 3.5/3.5mil（1OZ） | 3.0/3.5mil（1OZ） |
| Inner Layer Line Width/Spacing | 2.8/2.8mil（HOZ） | 2.5/2.5mil（HOZ） |
| Aspect Ratio | 20:1 | 25:1 |
| HDI | 3+N+3 | 7+N+7 |
| Impedance Control | ±10%(Inner 1OZ) | ±5%(Inner 1OZ) |
| Gold Finger Beveling Tolerance | ±0.075mm | ±0.05mm |
| Registration | 4.5mil | 4mil |
| Max Backdrill Stub | 8mil | 6mil |
| Min Drill Hole | 7mil | 7mil |
| Oxide Treatment | Low Profile Oxide | Low Profile Oxide |
| Low-loss Solder Mask | Y | Y |
| Network Analyzer Test Bandwidth | 26.5GHz | 43.5GHz |
| Test Method | Delta-L 4.0 | |
| Probe Bandwidth | 40G/Delta-L 4.0 | 40G/Delta-L 4.0 |
| Special Processes | N+N, Hybrid Lamination, HDI, Deep Microvia, Stepped Gold Fingers, Variable-length Gold Fingers, QR Code, POFV, Backdrill, etc. | |
| Data Communication | ||
| Features | Standard | Advanced |
| Back Plane Max. Layer Count | 60 | 70 |
| Back Plane Max Board Thickness | 8mm | 10mm |
| Back Plane Aspect Ratio | 23:1 | 25:1 |
| Back Plane Max. Dimension | 1200*680mm | 1200*680mm |
| Line Card Max. Layer Count | 42 | 62 |
| Line Card Max Board Thickness | 6mm | 8mm |
| Line Card Aspect Ratio | 23:1 | 25:1 |
| Line Card Max. Dimension | 1200*680mm | 1200*680mm |
| Inner Layer Line Width/Spacing | 2.8/2.8mil | 2.8/2.8mil |
| Outer Layer Line Width/Spacing | 3.5/3.5mil | 3.0/3.5mil |
| Same Core Registration | ±25um | ±20um |
| Overall Layer Registration | ±5mil | ±4.5mil |
| Min Mechanical Drilling Hole Size | ≥0.15mm(6mil) | ≥0.13mm(5mil) |
| Min Laser Drilling Hole Size | 50-150um | 50-200um |
| Resin Plugging Aspect Ratio | 25:1 | 30:1 |
Max Inner Layer Copper Thickness (High-speed Hybrid) | 4oz | 6oz |
| Thermal Managemant & High Current Density | ||
| Features | Standard | Advanced |
| Max. Layer Count | 32 | 40 |
| HDI | 2+N+2 | 3+N+3 |
| Max Board Thickness | 6.5mm | 10mm |
| Thick Hole Copper Thickness | 50um | 100um |
| Inner Layer Copper Thickness | 15 oz | 30 oz |
| Layer-to-layer Alignment | ±75 um | ±75 um |
| Press-fit Hole Diameter Tolerance | ±50 um | ±50 um |
| High Voltage Test | Withstand voltage up to 6000V DC for 60s, leakage current 40μA | |
| Inductance Test | ±10% | |
| Line Width/Line Space[2oz] | 6/6mil | 5.5/5.5mil |
| Line Width/Line Space[3oz] | 8/8mil | 7/7mil |
| Line Width/Line Space[4oz] | 10/10mil | 9/9mil |
| Line Width/Line Space[5oz] | 12/12mil | 11/11mil |
| Line Width/Line Space[6oz] | 14/14mil | 13/13mil |
| Special Processes | Castellated Holes/Edge Plating/Half-filled Vias | |
| Thermal Management | Embedded Copper Coin/Thick Plated Hole/Metal Base/Dense Vias/Copper Busbar/Copper Paste Filling/Localized Thick Copper | |
| Industrial Control & Robot | ||
| Features | Standard | Advanced |
| Max. Layer Count | 30 | 40 |
| HDI | 3+N+3 | 7+N+7 |
| Mechanical Drilling Hole Size | 0.2mm | 0.15mm |
| Laser Drilling Hole Size | 100-150um | 75-200um |
| Max. Copper Thickness | 6oz | 15oz |
| Rigid-Flex Construction | Symmetrical structure, Air-gap, Flying tail structure, Multilayer flex | |
| Surface Treatment | ENIG/OSP/Immersion Tin/Immersion Silver/ENEPIG/Gold Fingers/Electrolytic Soft Gold/Electrolytic Hard Gold | |
| Special Processes | Resin Plugging, Mechanical Blind Holes, Laser Micro-via, Depth-controlled Drilling/Blind Routing, Castellated Holes, Semi-flex Boards, POFV, Localized Thick Copper (tolerance 1oz), etc. | |
| Laminate | S1000H，S1000-2M，S1150G，S1151G，Autolad1，Autolad1G，Autolad3，Autolad3G，IT-158，IT-180A，TU-865，EM827 | |
| Laminate | VT-47, 370HR, R-5775 | |
| Reliability Test | CCAF, HAST, Thermal Shock, Temperature/Humidity Cycling, IST, Solderability, Thermal Stress | |
| Reliability Test | Ionic Contamination, Ion Chromatography | |
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