AI Accelerator Card PCB SolutionAdopting 26-layer 7+1 HDI and M7-grade materials, it meets the requirements of GPU stacking design and signal loss control.
Heterogeneous Supercomputing Server PCB SolutionAdopting 20-layer boards with 10 types of 3D back-drilling and M7-grade materials, supported by high-precision back-drilling and high-speed materials, it satisfies strict signal integrity requirements.
Power Brick ModuleFeaturing a 22-layer 1+1 HDI design, 6oz copper thickness on inner and outer layers, and ultra-thick plated through holes, it fulfills high power density requirements.GaN embedding technology is applied to reduce switching loss and ensure high power conversion efficiency.
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