DIP dual in-line package, component package, PGA pin grid, BGA ball grid array (PBGA substrate, CBGA substrate, FCBGA substrate, TBGA substrate, CDPBGA substrate), CSP package (traditional lead frame form, rigid interposer type, soft interposer type, wafer size package), MCM package, etc.
DetailTake the LED screen with P0.9 for example.Generally, the PCB of COB-P0.9 is 8 layers and 3 levels.Because the lamp bead itself has been integrated with circuits, the IMD-M09T only requires 8 pins for 4 pixels, which increases the PCB wiring space of the screen factory by 50%. Customers using the IMD-M09T typically only require 6 layers of 2-stage PCBs, which is more than 20% cheaper.SMD also requires an 8-layer 3-stage PCB board, but the accuracy requirements are not as high as COB.
DetailWhen designing a multilayer PCB for a planar transformer, it is recommended to use a symmetrical stacking design to avoid deformation during PCB processing and assembly. The thickness of the dielectric layers needs to meet the insulation requirements for the primary and secondary windings, and the dielectric thickness of the entire stack should be uniform.
Detailwhether it is traditional millimeter-wave radar or 4D millimeter-wave radar, the mainstream solution will have two high-frequency layers in the PCB laminate, using PTFE as the material. The PCB board for 4D millimeter-wave radar has also been upgraded from the primary PTFE material (such as RO4850/RO4350) to a higher-grade high-frequency PTFE material (such as RO3003/RO3006).
DetailAs the transmission rate of high-speed signals increases from 50G to 100G to 200G, the loss of the transmission system increases from less than 10dB to more than 20dB. When the signal transmission rate exceeds 200G, the interconnection complexity of PCB boards increases, and almost all signal line routing lengths will exceed the loss budget of 1m DAC line transmission.
DetailNVIDIA H200 is the first GPU to offer HBM3e, a faster and larger memory that accelerates generative AI and large language models while enabling scientific computing for HPC workloads. With HBM3e, NVIDIA H200 delivers 141GB of memory at 4.8 TB per second.
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