Power Chip Embedded PCB

·  New Energy Vehicle (NEV) OBC (On-Board Charger) Module

·  Number of ICs: 6 (Half-bridge)

·  Signal Wiring Layers: 1

·  Copper Thickness: 2 oz

·  AMB Size: 30 × 30 mm

·  Number of AMBs: 1

·  Chip Silver Sintering

Embedded Magnetic Ring PCB

·  Sensor Module

·  Number of Magnetic Rings: 1

·  Wiring Layers: 4

·  Inner Layer Copper Thickness: 1 oz; Finished Copper Thickness: ≥ 1.5 oz

·  Magnetic Ring Dimensions: Inner Diameter (ID) 29.85 mm × Outer Diameter (OD) ·  37.98 mm × Thickness 4.75 mm

·  Finished Board Thickness: 6.4 mm