High Speed PCB
·Layer count —— 26L
·Material —— Tachyon 100G
·Board Thickness —— 3.5±0.35mm
·Copper thickness —— 0.33OZ
·Min. LW/LS —— 0.118/0.051mm
·Min. hole Size —— 0.225mm
·Surface Finish —— ENIG
·Application field —— Industrial Control
5G Communication High Speed Products
·22 Layer PCB
·High Speed Low Loss
·2 Lam- L22-3 and L1-22
·11 Sets of Back Drill, VIPPO
·20 T-Coins 22-3/3-1
·10 set of CI Single/Diff
·HVLP Copper
▪ Layer count —— 2L
▪ Material —— Doosan DS-7409DV Low Loss
▪ Board thickness —— 0.6±0.6mm
▪ Min. LW/LS —— 0.580mm±5%
▪ Min. Drill Size —— 0.2mm
▪ Surface Finish —— Immersion tin
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