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5G High Frequency PCBs

Layer count——8L

Material——MT77

Board thickness——1.43mm

Copper Thickness——1 oz

Min. LW/LS——0.25/0.25mm

Min. Drill Size ——0.3mm

Surface Finish——ENIG

Back drilling——0.127


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IC Substrate

Layer count——6L

Material——DS7409-HGB

Board thickness——0.5mm

Copper Thickness——H/H oz

Min. LW/LS——0.05/0.04mm

Min. Drill Size ——0.07mm

Surface Finish——ENEPIG



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5G Communication High Speed Products

22 Layer PCB

High Speed Low Loss

▪ 2 Lam- L22-3 and L1-22

▪ 11 Sets of Back Drill, VIPPO

▪ 20 T-Coins 22-3/3-1

▪ 10 set of CI Single/Diff  

HVLP Copper   

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Optical module products

Layer count——10L

Product model——400Gbps QSFP-DD

Material——M6(R-5775)

Finished Thickness——1.0±0.075mm(Gold Finger)

Plug shape tolerance——±0.05mm

Hole filling depression——<15μm

Surface Finish——ENEPIG+Hard gold

Thermal management——Buried copper block 


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High frequency antenna board

▪ Layer count —— 2L

▪ Material —— Doosan DS-7409DV Low Loss

▪ Board thickness —— 0.6±0.6mm

▪ Min. LW/LS —— 0.580mm±5%

▪ Min. Drill Size —— 0.2mm

▪ Surface Finish —— Immersion tin

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Special PCB

▪ Layer count —— 4L

▪ Material —— FR4 TG170

▪ Board thickness —— 3.6mm

▪ Min. LW/LS —— 0.12/0.12mm

▪ Min. Drill Size —— 0.25mm

▪ Surface Finish —— ENIG

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RF PCB

▪ Layer count  —— 16L

▪ Material —— ROGERS 4350 + s1000-2 (HI-Tg FR4)

▪ Board thickness  —— 2.61±0.248mm

▪ stack-up  —— Cavity Construction

▪ Special —— Hybrid of FR4 + Rogers

▪ Min. LW/LS —— 0.1mm

▪ Surface Finish —— ENIG Finish

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Subsidiaries:SGC Germany  |  Sunshine PCB GmbH   |  SGC USA
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