Mall
Language

中文 English

Product

HDI PCB

▪ Layer count   —— 24L

▪ Material   —— FR-4(Tg180) VT-47

▪ Board thickness   —— 2.59+/-0.26mm

▪ Min. LW/LS —— 3.5/5.0mil

▪ Min. Drill Size —— 0.25mm

▪ Surface Finish —— Immersion gold

HDI PCB

▪ Layer Count  —— 20L

▪ Material  —— ISOLA FR408

▪ Board Thickness —— 2.4±0.1mm

▪ Stack-up —— 8+N +8

▪ Aspect Ratio ——12:1,8mils Hole to Copper

▪ Blind vias  —— L1–L8 , L13–L20

▪ Micro-vias —— L1–L2 , L19–L20

▪ Via-in-Pad —— 1mm -0.65mm BGAs

▪ Min. LW/LS —— 0.075mm

▪ Surface Finish——ENIG+ Hard Gold Finish

lALPBFRybh4LbxvNAmfNAtA_720_615.png

Copper Coin Inlay Design

Application: Thermal Management Solutions

Solid copper pressfitted into the board

Can be applied in cavity or top to bottom

  PTH may be connected if required

Layer count   —— 4L

Material —— S1000-2

Board thickness   —— 1.58mm

Min. LW/LS —— 0.1mm

Surface Finish ——ENIG


jgt.jpg
spercialpcb06.png

Special PCB For MinLED

 Layer count   —— 8L

HDI(2+N+2)

Micro vias —— L1-L2, L2-L3, L6-L7, L7-L8

Buried holes —— L2-L7

Pad to Pad spacing —— 2.8mil

Pad size —— 3.0x3.0mil

Surface Finishing   ENEPIG     



spercialpcb05.png
Subsidiaries:SGC Germany  |  Sunshine PCB GmbH   |  SGC USA
©Sunshine Global Circuits Co., Ltd.2018 All rights reserved. 粤ICP备05084072号   Design byszweb.cn