As AI continues to penetrate and empower all industries, customers are accelerating their product design toward higher computing density, higher integration, and higher heat dissipation requirements. As the foundation for the interconnection of electronic components, whether PCBs can meet the various requirements of current customer product design indicators has become a key test for PCB manufacturers.

At this exhibition, Sunshine took five major application scenarios as entry points: AI data centers, data communications, automotive, industrial control & robotics, and semiconductor testing. The company demonstrated its manufacturing capabilities in PCB technology fields such as high-speed interconnection, HDI, large-size ultra-thick backplanes, heavy copper, rigid-flex and high-frequency PCBs, enabling it to continuously provide customers with state-of-the-art PCB solutions.

During the three-day exhibition, customers visiting Sunshine’s booth showed strong interest in its industry-oriented PCB solutions. The on-site service team composed of sales and technical staff responded quickly to various inquiries from customers, ensuring that every visitor came with questions and left with clear answers.

Looking ahead, Sunshine will continue to follow the latest PCB product demands in various specialized industries, translate customer needs into its own technological capabilities, and continuously create value for customers.