Driven by the explosive demand for AI chips and high-performance computing, PCB manufacturing is rapidly evolving toward finer line widths, higher density and higher layer counts. With more than two decades of deep industry expertise, Sunshine has developed full-scenario PCB solutions covering five specialized segments: AI data centers, data communications, automotive electronics, industrial control & robotics, and semiconductor testing.

At the show, Sunshine featured its advanced PCB product portfolio, including high-end high-density HDI, premium high-speed PCBs, ultra-heavy copper PCBs, high-frequency hybrid laminates, rigid-flex PCBs and semiconductor test boards. From low-loss substrates and high-performance copper foils to mSAP processes and stacked microvia technology, the Company fully demonstrated its leading process capabilities that satisfy the stringent signal integrity requirements of AI computing, optical communication and satellite communication. The booth attracted a constant stream of visitors; many professional attendees stopped by for technical exchanges and business discussions.