Capability
Since its establishment, Sunshine has consistently pursued a core strategy of technology-driven development, building a comprehensive R&D system that integrates strategic guidance, platform support, team-driven innovation, and technological breakthroughs.

Sunshine has established an independent Technology Center that oversees the entire R&D process. The R&D team comprises over 300 professionals, with core members being senior industry experts with more than 10 years of experience. These experts possess deep insights into industry chain evolution and cutting-edge market demands, demonstrating strong foresight in anticipating technology trends and translating market needs into technical solutions.


For R&D platform construction, Sunshine has been approved to establish the "Guangdong Provincial Engineering Technology Research Center for 5G High-Density Interconnect HDI Circuit Boards" (a provincial-level key R&D platform). This center focuses on tackling key common technologies in the 5G high-density interconnect HDI circuit board sector, driving technological innovation and industrial application breakthroughs.

 
Through continuous independent R&D, Sunshine has developed a diversified technology matrix covering multilayer, HDI, high-frequency/high-speed, rigid-flex, flexible circuits, metal-based, thick copper, semiconductor test PCBs, and packaging substrates. Core technologies span the entire process chain from material adaptation and process optimization to precision manufacturing, creating significant technical barriers and differentiated competitive advantages.

Technology Roadmap
inch [mm] Standard
Advanced
Emerging
Future
Key Attributes Layer Count Up to 32L Up to 40L Up to 70L >70L
Min/Max Thickness .012” [.30]/.200" [5.0] .008" [.20]/.315" [8.0] .006” [.15]/.315" [8.0] TBD/≥.394" [10.0]
Largest Panel 24x28[610x712] 24x30 [610 x 760] 26.7x47.2 [680 x 1200] undetermined
 
Minimum Line and Space (Copper Wts*) Inners .003" [.076] H .0025" [.064] H < .002" [.05] H <.002" [.05] H
Outers .004" [.10] 1 .003" [.076] 1 < .0025" [.064] 1 <.0025" [.064] 1
Tolerance ±.0005" [.013] ±.0003" [.008] ±.00025" [.006] ±.0002" [.005]
 
Drilled Vias Size Drill Size .008" [.20] .006" [.15] .005" [.13] .004" [.10]
Pad Diameter +.008" [.20] +.008" [.20] +.006" [.15] .004" [.10]
Aspect Ratio 25:1 30:1 40:1 >40:1
Base copper weights: 1=1oz H=1/2 OZ, T=3/8 OZ, Q=1/4 OZ
Via Structures Microvias 3+N+3 7+N+7 ELIC UNiFYi MVs
Buried Subs Yes Yes Yes Yes
Stacked Microvia Stacked/Staggered Offset/Staggered Offset/Staggered Offset/Staggered
 
Microvias Min Via Size .004" [.10] .003" [.076] .002" [.05] .002" [.05]
Pad Diameter +.006" [.15] +.004" [.10] +.003" [.076] +.003" [.076]
Aspect Ratio 0.8:1 0.8:1 1:1 1.2:1
 
Conductive & Non-Conductive Via Fill Min Hole Size .008" [.20] .006" [.15] .005" [.13] <.005" [.13]
Aspect Ratio 25:1 30:1 40:1 40:1
 
Soldermask Registration ±.002" [.05] ±.0015" [.038] ±.001" [.025] Tangency
Min Opening .004" [.10] .003" [.076] .002" [.05] SMDP
Dam Min Width .003" [.0076] .002" [.05] .0015" [.038] Eng Eval
Surface Finishes OSP, LF HASL Thick Gold & Multiple Finishes undetermined
Im Sn, Im Ag, ENIG, ENEPIG
Hard Gold, Flash Gold
Multiple Finishes
Material Options High frequence: Rogers 3000/4000, TFA300 series, F4BME  series, mmWave 77
High speed: MEGTRON series (M2-M8),  @EMC, @ITEQ, @TUC, @ISOLA, @AGC.etc
High Tg: IT180A, S1000-2M, TU865,EM370(Z), @ISOLA, @AGC.etc
Others:Buried Capacitance, Buried resistor, Polyimid, High Thermal Conductive, Halogen Free Materials,.etc
Subsidiaries:SGC Germany  |  Sunshine PCB GmbH   |  SGC USA
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