Sunshine is committed to technology development
Our CTO David Aldape has over 30 years of industry experience,and leads a dedicated team of R&D engineers.
Development projects for 2016-2017:
Increase Plating Aspect Ratio to 30:1 or higher
Backplane capability;large format and very thick boards
Reduce controlled impedance to lerance of ±5% or less
Introduction of advanced plating and photo lithography methods
Advanced tooling systems for improving L2L registration
Continual addition of new materials for HDI, High Speed/Low Loss,thinnerstructures and sub‐assemblies applications (for example: ZETA®,I‐Tera®,I‐Speed®,Tachyon G100®, Megtron 7, and EMC 828&888K)
Deep Microvias (L1‐L3, Aspect Ratio 1:1 or greater)
Thermal Management Solutions: Metal Core, Conductive Paste (Ormet and Tatsuta)
Embedded Component PCBs.
| Technology Roadmap | |||||
|---|---|---|---|---|---|
| inch [mm] | Standard | Advanced | Emerging | Future | |
| Key Attributes | Layer Count | Up to 32L | Up to 40L | Up to 70L | >70L |
| Min/Max Thickness | .012” [.30]/.200" [5.0] | .008" [.20]/.315" [8.0] | .006” [.15]/.315" [8.0] | TBD/≥.394" [10.0] | |
| Largest Panel | 24x28[610x712] | 24x30 [610 x 760] | 26.7x47.2 [680 x 1200] | undetermined | |
| Minimum Line and Space (Copper Wts*) | Inners | .003" [.076] H | .0025" [.064] H | <.002" [.05] H | <.002" [.05] H |
| Outers | .004" [.10] 1 | .003" [.076] 1 | <.0025" [.064] 1 | <.0025" [.064] 1 | |
| Tolerance | ±.0005" [.013] | ±.0003" [.008] | ±.00025" [.006] | ±.0002" [.005] | |
| Drilled Vias Size | Drill Size | .008" [.20] | .006" [.15] | .005" [.13] | .004" [.10] |
| Pad Diameter | +.008" [.20] | +.008" [.20] | +.006" [.15] | .004" [.10] | |
| Aspect Ratio | 25:1 | 30:1 | 40:1 | ＞40:1 | |
| Base copper weights: 1=1oz H=1/2 OZ, T=3/8 OZ, Q=1/4 OZ | |||||
| Via Structures | Microvias | 3+N+3 | 7+N+7 | ELIC | UNiFYi MVs |
| Buried Subs | Yes | Yes | Yes | Yes | |
| Stacked Microvia | Stacked/Staggered | Offset/Staggered | Offset/Staggered | Offset/Staggered | |
| Microvias | Min Via Size | .004" [.10] | .003" [.076] | .002" [.05] | .002" [.05] |
| Pad Diameter | +.006" [.15] | +.004" [.10] | +.003" [.076] | +.003" [.076] | |
| Aspect Ratio | 0.8:1 | 0.8:1 | 1:1 | 1.2:1 | |
| Conductive & Non-Conductive Via Fill | Min Hole Size | .008" [.20] | .006" [.15] | .005" [.13] | <.005" [.13] |
| Aspect Ratio | 25:1 | 30:1 | 40:1 | ＞40:1 | |
| Soldermask | Registration | ±.002" [.05] | ±.0015" [.038] | ±.001" [.025] | Tangency |
| Min Opening | .004" [.10] | .003" [.076] | .002" [.05] | SMDP | |
| Dam Min Width | .003" [.0076] | .002" [.05] | .0015" [.038] | Eng Eval | |
| Surface Finishes | OSP, LF HASL | Thick Gold & Multiple Finishes | undetermined | ||
| Im Sn, Im Ag, ENIG, ENEPIG | |||||
| Hard Gold, Flash Gold | |||||
| Multiple Finishes | |||||
| Material Options | High frequence: Rogers 3000/4000, TFA300 series, F4BME series, mmWave 77 | ||||
| High speed: MEGTRON series (M2-M8), @EMC, @ITEQ, @TUC, @ISOLA, @AGC.etc | |||||
| High Tg: IT180A, S1000-2M, TU865,EM370(Z), @ISOLA, @AGC.etc | |||||
| Others:Buried Capacitance, Buried resistor, Polyimid, High Thermal Conductive, Halogen Free Materials,.etc | |||||
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