|
inch [mm]
|
Standard
|
Advanced
|
Emerging
|
Future
|
|
Key Attributes
|
Layer Count
|
Up to 32L
|
Up to 40L
|
Up to 70L
|
>70L
|
|
Min/Max Thickness
|
.012” [.30]/.200" [5.0]
|
.008" [.20]/.315" [8.0]
|
.006” [.15]/.315" [8.0]
|
TBD/≥.394" [10.0]
|
|
Largest Panel
|
24x28[610x712]
|
24x30 [610 x 760]
|
26.7x47.2 [680 x 1200]
|
undetermined
|
|
|
|
Minimum Line and Space (Copper Wts*)
|
Inners
|
.003" [.076] H
|
.0025" [.064] H
|
<
.002" [.05] H
|
<.002" [.05] H
|
|
Outers
|
.004" [.10] 1
|
.003" [.076] 1
|
<
.0025" [.064] 1
|
<.0025" [.064] 1
|
|
Tolerance
|
±.0005" [.013]
|
±.0003" [.008]
|
±.00025" [.006]
|
±.0002" [.005]
|
|
|
|
Drilled Vias Size
|
Drill Size
|
.008" [.20]
|
.006" [.15]
|
.005" [.13]
|
.004" [.10]
|
|
Pad Diameter
|
+.008" [.20]
|
+.008" [.20]
|
+.006" [.15]
|
.004" [.10]
|
|
Aspect Ratio
|
25:1
|
30:1
|
40:1
|
>40:1
|
|
Base copper weights: 1=1oz H=1/2 OZ, T=3/8 OZ, Q=1/4 OZ
|
|
Via Structures
|
Microvias
|
3+N+3
|
7+N+7
|
ELIC
|
UNiFYi MVs
|
|
Buried Subs
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Stacked Microvia
|
Stacked/Staggered
|
Offset/Staggered
|
Offset/Staggered
|
Offset/Staggered
|
|
|
|
Microvias
|
Min Via Size
|
.004" [.10]
|
.003" [.076]
|
.002" [.05]
|
.002" [.05]
|
|
Pad Diameter
|
+.006" [.15]
|
+.004" [.10]
|
+.003" [.076]
|
+.003" [.076]
|
|
Aspect Ratio
|
0.8:1
|
0.8:1
|
1:1
|
1.2:1
|
|
|
|
Conductive & Non-Conductive Via Fill
|
Min Hole Size
|
.008" [.20]
|
.006" [.15]
|
.005" [.13]
|
<.005" [.13]
|
|
Aspect Ratio
|
25:1
|
30:1
|
40:1
|
>
40:1
|
|
|
|
Soldermask
|
Registration
|
±.002" [.05]
|
±.0015" [.038]
|
±.001" [.025]
|
Tangency
|
|
Min Opening
|
.004" [.10]
|
.003" [.076]
|
.002" [.05]
|
SMDP
|
|
Dam Min Width
|
.003" [.0076]
|
.002" [.05]
|
.0015" [.038]
|
Eng Eval
|
|
Surface Finishes
|
OSP, LF HASL
|
Thick Gold & Multiple Finishes
|
undetermined
|
|
Im Sn, Im Ag, ENIG, ENEPIG
|
|
Hard Gold, Flash Gold
|
|
Multiple Finishes
|
|
Material Options
|
High frequence: Rogers 3000/4000, TFA300 series, F4BME series, mmWave 77
|
|
High speed: MEGTRON series (M2-M8), @EMC, @ITEQ, @TUC, @ISOLA, @AGC.etc
|
|
High Tg: IT180A, S1000-2M, TU865,EM370(Z), @ISOLA, @AGC.etc
|
|
Others:Buried Capacitance, Buried resistor, Polyimid, High Thermal Conductive, Halogen Free Materials,.etc
|