Provide additional routing density、Improved Impedance Performance、 RF Micro Via Solutions、Solid Copper Plated Surface for BGAs、 Improved Current Carrying Capacity
Thermal Management 、Improved Heat Distribution 、 Increased Thermal Conductivity、Copper core CTE 17ppm/C 、 Thermal Conductivity 385 WmK
Buried internal resistors 、Aerospace, Telecommunications、Micro Wave and Medical 、Flexable circuit heaters
All layer via maximizes design freedom、 Solid Copper provides better reliability、 Superior Electrical characteristics
Buried resistors and printed internal resistors 、Buried capacitors and dielectric insulators 、 Planar convertors and transformers 、 Embedded semiconductors and thin dies、 Flex-rigid embedded components
Recessed Chips for Gold Wire Bonding 、 Connectors with limited thickness
WeChat
