At present, for the 16GT/s rate of PCIe 4.0, the motherboard already needs to use Megtron 4/Megtron 6 materials. Considering that the size of CPU chips is continuously increasing, in the era of PCIe 5.0 and PCIe 6.0, the motherboard PCB materials need to be further upgraded to Megtron 6/Megtron 7 levels. The copper foil type needs to be selected as HVLP (low roughness) or above to reduce the loss caused by the skin effect of the signal.
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Thermal design is an important part of reliability design. Good thermal design can prevent thermal failures on circuit boards and improve work reliability. In the long term, it can also extend the service life of the circuit boards.
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Tg, which stands for Glass transition temperature, is an abbreviation where "T" represents temperature and "g" is subscript, representing "Glass."
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The performance indicators for FR-4 substrates include the glass transition temperature (Tg), the thermal decomposition temperature (Td), the dissipation factor (Df), the dielectric constant (Dk), the comparative tracking index (CTI), the thermal expansion coefficient (CTE), the water absorption rate, and the material's adhesion characteristics.
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Before the PCB design starts, the Layout engineers will determine the number of layers of the PCB according to the size of the board, the scale of the circuit, and the requirements of electromagnetic compatibility (EMC). Then they will determine the component layout, and finally confirm the division of signal layers, power layers, and ground layers.
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Considering that the backplane needs to withstand high-frequency, high-capacity high-speed signal transmission, the backplane PCB design needs to consider electrical performance, mechanical performance, reliability, heat dissipation performance, and other aspects. During manufacturing, high-performance materials and high-precision processing techniques are required to ensure that the backplane PCB meets performance requirements and works stably.
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